Testing high-density multilayer printed circuit board assemblies (PCBAs) with limited test points involves a cluster testing method. Providing test access to all devices and components on a PCBA for electrical testing may be impractical while maintaining impedance control and signal integrity for high-speed data transmission. To overcome this limitation, engineers can group clusters of interconnected components for testing, achieving higher coverage with limited test resources.
The clustering process requires engineers with knowledge of PCBA layouts to group components on a single board, specify measurements, such as impedance between critical nodes, and identify the measurement of these active and passive components. Failing to do so would result in inconsistencies in measurement results, as the impedance produced by the active component would shift the measured value. Engineers need automated cluster formation and test plan generation.
Automated cluster generation solution for passive components
Testing high-density, multilayer PCBAs need an automated solution that streamlines cluster formation for passive components. The Keysight i3070 Series 7i High-Density In-Circuit Test System provides an automated solution for creating dependable passive device clusters and generating test plans. This test system leverages the power of an algorithm from the Advanced Cluster Library (ACL) to ensure efficient cluster formation for improved testing precision, quicker test execution, and enhanced reliability in their production processes.
How to Test Passive Components without Access Points
E9988GL In-Line High-Density ICT System; Series 7i
The E9988GL Keysight i3070 Series 7i Inline High-Density In-Circuit Test (ICT) system brings ICT technologies into your automated manufacturing line, saving resources and optimizing your automated test strategy.
