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Highlights

Introducing the Keysight i3070 Series 7i inline test system — your path to superior test coverage and enhanced throughput.

Featuring the latest Quad-Density Pin Cards, Series 7i can accommodate up to 5760 test nodes while maintaining a slim 800mm width footprint. This increased capacity provides more resources for complex testing requirements and allows for processing larger panels while saving board handling and transfer time.

Rest easy knowing your investment is secure, as the Series 7i guarantees full backward compatibility with current E9988E and E9988EL test programs and fixtures.

  • Doubles Test Nodes: Accommodates up to 2x more test nodes while maintaining a compact footprint.
  • Integrates Supercapacitor Testing: Effortlessly tests supercapacitors up to 100 Farads (F) through an available integration solution.
  • Enables Low-Current Measurement: Achieves measurements as low as 100 nano-Amperes (nA), streamlining development time.
  • Accelerates Shorts Test: Executes Enhanced Shorts Test algorithm 50% faster compared to traditional methods.
  • Enhances Coverage: Improves coverage via automatic cluster test generation.
  • Facilitates Expansion: Offers a built-in functional port for expanding test capabilities.
  • Overcomes Access Limitations: Integrates x1149 Boundary Scan Analyzer to overcome restricted test access.

For more information about Keysight's ICT systems, please visit www.keysight.com/find/ict

Award-Winning Board Test Solution

EM Innovation Award 2024

EM Innovation Award 2024

We are delighted to announce that the Keysight i3070 Series 7i has been honored with the prestigious EM Innovation Award 2024 in the 'Printed Circuit Board Assembly-Testing - ICT-Inline-Test' category during the 19th EM Innovation Awards ceremony.

This recognition is a testament to our relentless commitment to innovation and excellence in providing cutting-edge solutions that revolutionize the industry landscape.

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Related Use Cases

How to Automate Supercapacitor Testing

How to Automate Supercapacitor Testing

Testing a supercapacitor on a printed circuit board assembly (PCBA) requires measuring its equivalent series resistance (ESR) and capacitance during the in-circuit test (ICT). Learn how to automate this process with intelligent program generation, DC electronic load, and a source measure unit into an ICT to accelerate supercapacitor testing.

How to Test LEDs on PCBAs

How to Test LEDs on PCBAs

Testing printed circuit board assemblies embedded with LEDs during the in-circuit test stage requires integrating an LED analyzer into the tester. Learn how to perform LED testing on an in-circuit tester using an automated system and analysis.

How to Perform Low-Current Measurements on PCBAs

How to Perform Low-Current Measurements on PCBAs

Testing low current in PCBAs during the in-circuit test stage requires complex test planning and incorporation of external test instruments. Learn how to integrate source measure units into the in-circuit testers to simplify the testing process.

How to Test Passive Components without Access Points

How to Test Passive Components without Access Points

Testing passive components on high-density PCBAs without test points necessitates grouping components into clusters and calculating impedance for precise testing. Learn how the enhanced cluster test solution automates the cluster generation process, ensuring efficient and accurate testing.

How to Speed Up Short Testing for High-Impedance Nodes

How to Speed Up Short Testing for High-Impedance Nodes

Short testing for high-density printed circuit board assemblies, which include high-impedance nodes, requires numerous impedance measurements between nodes. Learn how the enhanced short test algorithm enables faster and more accurate short testing.

Extend the Capabilities for your High-Density In-Circuit Test (ICT) System, I337x Series 7i

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Featured Resources

Application Notes 2024.08.13

Guidelines for Upgrading i3070 Test System to Windows 11

Guidelines for Upgrading i3070 Test System to Windows 11

This application note outlines the steps for upgrading i307W0 test systems to Windows 11.

2024.08.13

Application Notes 2024.08.05

Integrating Supplementary Electronic Tests

Integrating Supplementary Electronic Tests

This application note is designed for electronics manufacturing professionals seeking to optimize their PCB testing processes. It provides detailed insights into integrating supplementary electronic tests, such as ISP, into the Keysight i3070 Series 7i ICT system. The document highlights the benefits, challenges, and step-by-step guidance for implementing these tests, making it an essential resource for improving test efficiency and product reliability.

2024.08.05

Application Notes 2024.05.30

Optimizing In-Circuit Testing with x1149 Boundary Scan Integration

Optimizing In-Circuit Testing with x1149 Boundary Scan Integration

This application note explores the integration of Keysight's x1149 Boundary Scan Analyzer with the i3070 Series 7i In-Circuit Test System, introducing a flexible and efficient approach to boundary scan testing. The integration eliminates challenges associated with built-in boundary scan systems, offering enhanced security, modularity, and greater flexibility in adapting to evolving protocols and functionalities.

2024.05.30

Application Notes 2024.05.15

Integrating Standalone x1149 Boundary Scan Analyzer into i3070 Series 7i

Integrating Standalone x1149 Boundary Scan Analyzer into i3070 Series 7i

This application note presents an installation guide for integrating the x1149 boundary scan analyzer into the i3070 Series 7i In-Circuit Test (ICT) system, enabling efficient boundary scan testing alongside in-circuit testing.

2024.05.15

Application Notes 2024.05.07

Integrating LED Analyzer with Keysight's In-Circuit Tester

Integrating LED Analyzer with Keysight's In-Circuit Tester

This application note explores how to seamlessly integrate the FEASA F LED Analyzer with Keysight's i3070 Series 7i In-Circuit Test System to streamline LED testing processes.

2024.05.07

Case Studies 2024.02.20

Future-Ready ICT Solutions for Enhanced Test Coverage

Future-Ready ICT Solutions for Enhanced Test Coverage

This case study explores a contract manufacturer's adoption of innovative ICT solutions for EV electronic components, amidst the rapid advancements in the EV industry. Facing challenges in accommodating the complexity of Electric Control Units (ECUs), the manufacturer sought a solution to enhance test coverage while preserving investments in existing fixtures. They implemented the E9988GL i3070 Series 7i ICT system, which improved efficiency and maintained a compact footprint. The successful integration led to reduced handling and testing times, empowering the manufacturer to meet deadlines and ensure long-term growth in EV manufacturing.

2024.02.20

Application Notes 2024.01.25

Quad Density Pin Card for Enhanced Throughput and Reliability

Quad Density Pin Card for Enhanced Throughput and Reliability

This application note addresses the evolving challenges in testing modern and densely packed Printed Circuit Board Assemblies (PCBAs) and introduces the Quad Density (QD) pin card as a groundbreaking solution. As electronic systems grow in complexity, the need for comprehensive testing becomes crucial. The current limitations of double-density pin cards prompt the development of the QD pin card, which offers 320 test pins on a single board, more than doubling its predecessor's capabilities. The QD pin card not only enhances test pin capacity but also introduces features like built-in discharge circuits and temperature sensors to optimize testing efficiency. Backward compatibility ensures seamless integration with older testing systems, and electronic serial number storage facilitates easy identification and troubleshooting.

2024.01.25

Application Notes 2024.01.24

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

This application note delves into the dynamic evolution of Printed Circuit Boards (PCBs) and the challenges posed by the advent of multilayered PCBs, particularly in the context of limited test points. It explores the significance of testing these intricate structures and introduces the concept of cluster testing as a solution.

2024.01.24

Application Notes 2024.01.23

Enhanced Short Tests for High Impedance Nodes

Enhanced Short Tests for High Impedance Nodes

This application note introduces an Enhanced Short Test algorithm tailored to tackle the testing challenges associated with high-impedance nodes in Printed Circuit Board Assemblies (PCBAs). Integrated into the Keysight In-Line High-Density In-Circuit Test (ICT) system, the Enhanced Short Test significantly boosts the efficiency of short detection for high-impedance nodes, leading to a noteworthy 57% reduction in testing time. High-impedance nodes, commonly found in modern PCBAs to enhance signal quality and reduce power consumption, present difficulties such as extended stabilization times, heightened sensitivity, diminished current flow, intricate isolation procedures, and concerns regarding signal stability.

2024.01.23

Application Notes 2024.01.10

Enhancing Supercap Testing in Automotive Electronics

Enhancing Supercap Testing in Automotive Electronics

This application note explores advancements in supercapacitor testing within automotive electronics, focusing on the seamless integration of Electronic Load (ELoad) and Source Measure Unit (SMU) technologies in an In-Circuit Tester.

2024.01.10

Application Notes 2024.01.08

Implementing Precision Low-Current Measurement in In-Circuit Testing

Implementing Precision Low-Current Measurement in In-Circuit Testing

This application note addresses the evolving landscape of the automotive industry, which increasingly relies on sophisticated electronic components. Ensuring the reliability of these components is paramount, and this document focuses on the critical role of precision low-current measurement in achieving this goal. The content explores the significance of low-current measurements in automotive Electronic Control Units (ECUs) and outlines the complexities associated with such measurements. Common approaches to low-current measurement are discussed to provide a comprehensive understanding of the challenges faced in the automotive electronics domain. In response to these challenges, the application note introduces a groundbreaking solution—a new In-Circuit Tester capable of seamlessly integrating Source Measure Units (SMUs). This innovation streamlines the low-current measurement process during the in-circuit test stage, offering enhanced precision and efficiency in automotive electronics testing.

2024.01.08

Application Notes 2023.11.06

i3070 In-Circuit Test System: Transitioning from 662xA to N6700 Series MPS

i3070 In-Circuit Test System: Transitioning from 662xA to N6700 Series MPS

This application note delves into the significant disparities between the Keysight 662xA and N67xx DUT power supplies, specifically in the context of the Keysight i3070 In-Circuit Test (ICT) system. It aims to facilitate the seamless migration of existing programs or the development of new ones for the N67xx series by providing in-depth technical insights. The N67xx Modular Power System offers enhanced features and capabilities, including power ratings and adjustable slew rates. Understanding these technical nuances is pivotal for a smooth transition and unlocks new possibilities for diverse applications.

2023.11.06

View All Resources

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