Memory Device BGA Interposers
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Keysight
Digital BGA
Interposer
Catalog
Keysight Technologies provides a range of Ball Grid Array (BGA) interposers, optimized for oscilloscope or logic analyzer measurements, that enable accurate testing directly at the ball grid array of memory/ processor systems
Memory System Validation
Keysight Technologies has the measurement tools you need to validate the very latest memory technologies. These include logic analyzers, oscilloscopes and software for automated compliance, decode, and protocol checking.
To complement our high speed digital instruments and software, Keysight offers probing solutions with a comprehensive range of Ball Grid Array (BGA) interposers. When positioned between the process or memory controller and the memory device, the interposers allow you to make signal quality or protocol measurements with minimal effect on the system-under-test.
Memory technology is constantly advancing in speed and density, and you need probing solutions that keep up with these developments. Keysight Technologies is at the forefront of the latest memory standards, chip technologies, and measurement techniques. Your Keysight Applications Engineer and Keysight’s Interposer Design Team can assist you with selecting the best BGA interposer and probing technique for your application.
You can choose from a large selection of existing interposer designs, or define probing solutions customized to your specific needs. Keysight’s standard interposers are available for several JEDEC standard packages with a variety of ball counts. The selection guide in this catalog gives you an overview of the interposers available and provides links to the corresponding data sheets. For additional DRAM packages or to meet different mechanical requirements, Keysight’s proven development process can produce custom BGA interposer designs of the highest quality.
Browse the catalog and then contact your local Keysight Applications Engineer for advice on the right products and measurement techniques to ensure the successful validation of your memory system.
Mark Schnaible
Applications Engineering Manager
Keysight Technologies
LPDDR3 178
BGA Signal Integrity Interposer
Probes JESD209-3B, 178 ball LPDDR3 memory devices
Signals Probed
The LPDDR3 178 BGA Interposer is optimized for oscilloscope measurements. It provides access to the LPDDR signals highlighted and passes all power and ground signals between the processor and the memory chip.
Key Features
- Enables correct operation of the LPDDR interface while providing access to selected bus signals between the processor and LPDDR memory chip.
- Provides solder pads for use with Keysight E2677A or N5381A InfiniiMax single-ended/differential solder-in or Keysight N5425A ZIF probe head.
- Includes S parameter file to configure the oscilloscope to render waveforms as they exist at the DRAM pins.
- Riser is included to clear surrounding devices in tight keep-out volume applications. Riser dimensions: 11.5 mm x 11 mm.
- For dimensional drawings see final page.
LPDDR4 200
BGA Signal Integrity Interposer
Probes JESD209-4A, 200 ball LPDDR4 memory devices
The LPDDR4 200 BGA Signal Integrity Interposer is optimized for oscilloscope measurements. It provides access to LPDDR signals highlighted and passes all power and ground signals between the processor and the memory chip.
Key Features
- Enables correct operation of the LPDDR interface while providing access to selected signals between the processor and LPDDR4 memory chip.
- Provides solder-down test pads with plated-through-holes that connect to Keysight E2677A or N5381A solder-in probe heads, or N5425A ZIF probe tip.
- Includes S-parameter file to configure the oscilloscope to render waveforms as they exist at the DRAMpins.
- Riser is included to clear surrounding devices in tight keep-out volume applications. Riser dimensions: 10x15mm.
- For dimensional drawings see final page.